Shielded carrier for land grid array connectors and a process for fabricating same
US6471525B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2001 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Feb 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/714
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a carrier with electrical shielding of individual contact elements, resulting in LGA interposer connectors with improved electrical performance. The carrier includes a plurality of openings, each of which may contain an individual contact element. The openings may be plated with conductive material, and may also be commoned to one or more reference voltages (e.g., ground) present on at least one conductive layer of the carrier. The carrier may be as simple as a single unified structure with a conductive layer on one outer surface, or much more complex, having many layers of dielectric and conductive material. The carrier may also provide improved retention of the individual contact elements. The process to assemble one embodiment of the carrier is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.