Method for forming an electrical contact with a semiconductor substrate
US6471847B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2001 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Jun 7, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67075
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a method and apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conductor is stored in a reservoir and pump through an inlet channel to the liquid chamber. The liquid conductor is injected into a liquid chamber such that the liquid conductor makes contact with the outer surface of the workpiece. An inflatable tube is also provided to prevent the liquid conductor from reaching the back face of the workpiece. A plating solution can be applied to the front face of the workpiece where a retaining ring/seal further prevents the plating solution and the liquid conductor from making contact with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.