Method for integrated circuit packaging
US6472251B1 · kind B1 · utility
3Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2001 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Apr 9, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/159
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a microelectronic device package is provided. The method includes a continuous processing mode of microelectronic device packages wherein process steps for fabricating the microelectronic device package are performed resulting in savings from the removal of more expensive batch processing steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.