Ronald D. Myer
2Patents
2h-index
9Co-inventors
33Inventor score
Filing activity: May 26, 1994 → Apr 9, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5492263A | Method for wire bonding an aluminum wire to a lead of an electronics package | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6472251B1 | Method for integrated circuit packaging | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.