Ball grid array type semiconductor device
US6472759B1 · kind B1 · utility
2Cited by
2References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 12, 2000 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Oct 12, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A BGA type semiconductor device having a high reliability when mounted on a printed circuit board by preventing cracks and breakage of weld balls of the BGA type semiconductor device. The semiconductor device includes a conductive board having a pair of terminals, a relay terminal and an external terminal, arranged at a distance from each other and on different surfaces of the conductive board. The relay terminal serves as a connection terminal formed on a wiring board. Moreover, a slit 7 is provided around the terminals provided on the conductive board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.