Enhanced laminate flipchip package using a high CTE heatspreader
US6472762B1 · kind B1 · utility
77Cited by
18References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 31, 2001 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Aug 31, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flipchip packaged integrated circuit comprising a substrate, a die and a heatspreader. The die may be configured to electrically attach to the substrate. The heat spreader may be rigidly attached to the die. The die and the heatspreader may have a combined coefficient of thermal expansion when attached. The heatspreader may be configured to match the combined coefficient of thermal expansion and a coefficient of thermal expansion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.