Bonding apparatus and bonding method
US6474538B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2000 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Oct 19, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A higher speed moving device moves a capillary at high speed. A low inertial moving and pressing device moves and presses the capillary with low inertia. The high speed motion, and the moving and pressing motion with the low inertia are carried out independently of each other. Thus, an inertia at the low inertial moving and pressing device is reduced, whereby an impact force when a melt ball is driven by the low inertial moving and pressing device into contact with an electrode of a semiconductor integrated circuit is restricted, thus enabling stable formation for minute bumps. On the other hand, operations other than pressing the melt ball to the electrode and joining the melt ball are conducted by driving the capillary by the higher speed moving device, so that productivity is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.