Mounting apparatus for electronic parts
US6474710B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2002 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Jan 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Mounting apparatus for electronic parts includes a mounting head and a suction-operated gripping mechanism for selectively gripping an object positioned adjacent one side of the gripping mechanism. A suction-operated attaching mechanism is also provided for selectively and removably attaching the gripping mechanism to the mounting head, whereby the gripping mechanism is removable from the mounting head and is hence replaceable. The mounting apparatus also has a viewing mechanism, including a camera, for viewing an object gripped by the gripping mechanism. The viewing mechanism is located on an opposite side of the gripping mechanism. The gripping mechanism has a light-transmitting portion positioned in such a manner that an object gripped by the gripping mechanism can be viewed by the camera through the gripping mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.