Lilogix, Inc.
3Patents
0Active
3Granted
22Portfolio score
Filing activity: Oct 17, 2001 → Jul 29, 2002
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6651866B2 | Precision bond head for mounting semiconductor chips | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6818543B2 | Process and apparatus for mounting semiconductor components to substrates and parts therefor | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6474710B2 | Mounting apparatus for electronic parts | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.