Method for controlling the sheet resistance of thin film resistors
US6475400B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2001 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Apr 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/474
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for controlling the sheet resistance of thin film resistors. The sheet resistance can be inexpensively controlled within a tight tolerance by determining a desired final value for the sheet resistance of thin film resistor material to be deposited on a substrate, depositing the resistor material on the substrate using a deposition process which is consistent enough to achieve a target sheet resistance within a first specified tolerance, the resistor material being deposited to achieve a target sheet resistance which is equal to the desired final value minus the first specified tolerance, and removing a small amount of material from the surface of the deposited thin film resistor material by etching or ion bombardment to raise the sheet resistance to the desired final value within a second specified tolerance characteristic of the removing process where the second specified tolerance is less than the first specified tolerance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.