Semiconductor device
US6476500B2 · kind B2 · utility
15Cited by
5References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 19, 2001 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Jul 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first semiconductor chip is mounted on a printed circuit board and a second semiconductor chip is mounted on said first semiconductor chip. The second semiconductor chip is displaced in a special direction from the center of the first semiconductor chip. This obviates the need for relay terminals on the side of the first semiconductor chip toward which the second semiconductor chip has been displaced. This allows the first semiconductor chip to be reduced in size by the area that would otherwise be occupied by the relay terminals, and thereby reduces the size of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.