Resin sealing method and resin sealing apparatus
US6476507B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 4, 2000 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Oct 4, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a resin sealing method, a plurality of semiconductor chips are placed in line on a sheet-type substrate with an adhesive tape, and electrodes provided on the semiconductor chips and the sheet-type substrate are connected with each other with wires, so that the connected substrate is fixed to a mold surface of a lower mold. Then, the lower mold and an upper mold are closed and thereafter molten resin is injected into upper cavities and lower cavities provided in line respectively and hardened. Then, the upper and lower molds are opened to take out the sheet-type substrate having the plurality of semiconductor chips sealed thereto, and the sheet-type substrate is cut along the boundaries between the semiconductor chips by dicing for completing each package. According to this method, particularly a BOC type CSP can be efficiently sealed with resin in high dimensional accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.