High frequency de-coupling via short circuits
US6477057B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2000 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Aug 17, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09663
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and implementing computer system are provided in which de-coupling capacitors are used at driver and receiver sources, and defined gaps are created separating power and ground areas on a voltage reference plane of a circuit board. Short-circuit via connections are also provided through one or more vias between spatially separated circuit board layers. Each driver or receiver module includes the driver or receiver along with an associated gap, capacitor and via connections to VDD and ground planes, all included within a defined proximity to effectively block switching energy and/or VDD noise from entering the tri-plate ground-to-ground reference system. In a related exemplary construction, signal lines are placed at predetermined positions between ground planes to provide a tri-plate circuit board structure for transmitting logic signals from a driver to one or more receivers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.