Patrick H. Buffet
21Patents
7h-index
31Co-inventors
61Inventor score
Filing activity: Jul 13, 2000 → Sep 23, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6499134B1 | Method of assigning integrated circuit I/O signals in an integrated circuit package | Physics | 73 | Expired |
| US6631502B2 | Method of analyzing integrated circuit power distribution in chips containing voltage islands | Physics | 48 | Expired |
| US6523150B1 | Method of designing a voltage partitioned wirebond package | Electricity | 28 | Expired |
| US6584596B2 | Method of designing a voltage partitioned solder-bump package | Physics | 22 | Expired |
| US6538314B1 | Power grid wiring for semiconductor devices having voltage islands | Electricity | 11 | Expired |
| US6586828B2 | Integrated circuit bus grid having wires with pre-selected variable widths | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6606732B2 | Method for specifying, identifying, selecting or verifying differential signal pairs on IC packages | Physics | 8 | Expired |
| US6762367B2 | Electronic package having high density signal wires with low resistance | Electricity | 7 | Expired |
| US7146596B2 | Integrated circuit chip having a ringed wiring layer interposed between a contact layer and a wiring grid | Electricity | 6 | Expired |
| US7017128B2 | Concurrent electrical signal wiring optimization for an electronic package | Electricity | 5 | Expired |
| US6495911B1 | Scalable high frequency integrated circuit package | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6703706B2 | Concurrent electrical signal wiring optimization for an electronic package | Electricity | 5 | Expired |
| US6477057B1 | High frequency de-coupling via short circuits | Electricity | 5 | Expired |
| US6978214B2 | Validation of electrical performance of an electronic package prior to fabrication | Physics | 5 | Expired |
| US7064570B2 | Method for locating IDDQ defects using multiple controlled collapse chip connections current measurement on an automatic tester | Physics | 4 | Expired |
| US6924661B2 | Power switch circuit sizing technique | Electricity | 4 | Expired |
| US7038319B2 | Apparatus and method to reduce signal cross-talk | Electricity | 4 | Expired |
| US6677774B2 | Method for locating IDDQ defects using multiple controlled collapse chip connections current measurement on an automatic tester | Physics | 3 | Expired |
| US6483720B1 | EMC protection in digital computers | Physics | 3 | Expired |
| US7454723B2 | Validation of electrical performance of an electronic package prior to fabrication | Physics | 1 | Active |
| US7000203B2 | Efficient and comprehensive method to calculate IC package or PCB trace mutual inductance using circular segments and lookup tables | Physics | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.