Apparatus and method for processing micro-V grooves
US6478661B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 28, 2001 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | Feb 28, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A voltage is applied between a cylindrical cutting grindstone 2 that rotates about a vertical axis Y and a cylindrical truing grindstone 6 that rotates about a horizontal axis X. The vertical outer surface 2a and the horizontal lower surface 2b of the cutting grindstone are trued by a plasma discharge. Then without applying the voltage, the cutting grindstone 2 is trued mechanically by the truing grindstone 6, and while the outer periphery and lower surface of the cutting grindstone are dressed electrolytically, the outer periphery and lower surface are made to contact a workpiece 1 and process a micro-V groove. This method makes it possible to produce an immersion grating with a high resolution using hard, brittle materials such as germanium, gallium arsenide and lithium niobate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.