Method of optimizing process of selective epitaxial growth
US6478873B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2000 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | Nov 27, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B25/165
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of optimizing a process of selective epitaxial growth sets a guideline for the reaction temperature, pressure, and gas ratio and calculates a non-equilibrium factor (NEF=[exp(l−(A/B))×C−D]×F×(1/S)) depending on the characteristic of the equipment and the types of source gases by controlling a super-saturation ratio depending on a basic thermodynamic law. The selective epitaxial growth by CVD is a deposition method by which a reactive product by thermal activation of a reactive gas is obtained in the shape of a thin film. Therefore, it can successfully form the selective epitaxial growth through control of the super-saturation ratio so that the selective epitaxial growth can be optimized. Also, the method can optimize the process by monitoring the quality of the thin film such as selectivity securing control of deposition speed, facet, reduction in deflects, etch depending on the pattern material. In addition, it can find out a relative process limit of the apparatus using the NEF to maximize development of the selective epitaxial growth apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.