Patent · US Expired

Semiconductor memory device and fabrication method thereof

US6479346B1 · kind B1 · utility

10Cited by
3References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 7, 2000
Grant dateNov 12, 2002
Priority date
Expiry dateApr 7, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S257/903

Abstract

In a semiconductor memory device including memory cells and a peripheral circuit unit, a memory cell has a first gate structure formed on a semiconductor substrate; a first impurity region of a first conductive type formed in the substrate on a first side of the gate structure; and a second impurity region formed in the substrate on a second side of the gate structure, the second impurity region including: a third impurity region of the first conductive type, a fourth impurity region of the first conductive type between the third impurity region and the second side of the gate structure, and a halo ion region of a second conductive type formed adjacent to the fourth impurity region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.