High density, high frequency memory chip modules having thermal management structures
US6480014B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2001 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | Feb 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention features an ultra high density, three-dimensional electronic circuit package suitable for constructing high capacity, high speed computer memory cards and the like. A demountable contact system allows easy test and/or burn-in. A memory card has a number of electrical receptacles adapted to receive a daughter card. The daughter card has memory devices attached to it and a corresponding number of electrical connectors placed along at least one edge, adapted to detachably mate with the electrical receptacles of the memory card. The demountable connectors allow easy rework of the module before optional, permanent solder attach. Bare dies or thin packages are mounted onto daughter cards, which in turn are mounted onto either a motherboard or memory card using pin/hole technology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.