Electronic assembly and cooling thereof
US6480385B2 · kind B2 · utility
14Cited by
9References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 10, 2001 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | Dec 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit that includes a die having a circuit area and outer edges. A guard ring surrounds the circuit area within the outer edges of the die. The guard ring includes a projection that extends to at least one outer edge of the die to extract heat from the die that is generated during operation of the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.