Method and device for transferring wafers
US6481945B1 · kind B1 · utility
503Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2000 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | Dec 5, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Enhanced inserts are formed having a cylindrical grip and a protrusion extending from the grip. An ultra hard material layer is bonded on top of the protrusion. The inserts are mounted on a rock bit and contact the earth formations off center. The ultra hard material layer is thickest at a critical zone which encompasses a major portion of the region of contact between the insert and the earth formation. Transition layers may also be formed between the ultra hard material layer and the protrusion so as to reduce stresses formed on the interface between the ultra hard material and the protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.