Memory card
US6483038B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2001 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | May 23, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/946
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a memory card having a reduced size as much as that of the package. The memory card includes electrical contact pads disposed in a single row on one end of the memory card. The memory card further comprises a card base and a semiconductor package. The card base has a first surface and a second surface, the first surface having a cavity formed thereon. The semiconductor package comprises a substrate, memory chips, and a molding resin layer, and is mounted on the cavity so that the external contact pads are exposed. Circuit wirings are formed on an inner surface of the substrate and electrically connected to the external contact pads that are formed on an outer surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.