Young-Hee Song
59Patents
15h-index
56Co-inventors
87Inventor score
Filing activity: Dec 10, 1993 → Aug 1, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7215033B2 | Wafer level stack structure for system-in-package and method thereof | Electricity | 375 | Expired |
| US7151009B2 | Method for manufacturing wafer level chip stack package | Electricity | 328 | Expired |
| US6483038B2 | Memory card | Emerging Cross-Sectional Technologies | 109 | Expired |
| USD432096S | Semiconductor module | General | 49 | Expired |
| US6724074B2 | Stack semiconductor chip package and lead frame | Electricity | 43 | Expired |
| US5428247A | Down-bonded lead-on-chip type semiconductor device | Electricity | 42 | Expired |
| US6849802B2 | Semiconductor chip, chip stack package and manufacturing method | Electricity | 41 | Expired |
| USD432097S | Semiconductor package | General | 37 | Expired |
| US6852607B2 | Wafer level package having a side package | Electricity | 36 | Expired |
| US5834832A | Packing structure of semiconductor packages | Emerging Cross-Sectional Technologies | 35 | Expired |
| US7208343B2 | Semiconductor chip, chip stack package and manufacturing method | Electricity | 29 | Expired |
| US6445077B1 | Semiconductor chip package | Electricity | 28 | Expired |
| US10474192B2 | Wearable smart device having flexible semiconductor package mounted on a band | Electricity | 19 | Active |
| US7368821B2 | BGA semiconductor chip package and mounting structure thereof | Emerging Cross-Sectional Technologies | 18 | Expired |
| US7317247B2 | Semiconductor package having heat spreader and package stack using the same | Electricity | 18 | Expired |
| US7205660B2 | Wafer level chip scale package having a gap and method for manufacturing the same | Electricity | 10 | Expired |
| US7821127B2 | Semiconductor device package having buffered memory module and method thereof | Emerging Cross-Sectional Technologies | 9 | Active |
| US7453159B2 | Semiconductor chip having bond pads | Electricity | 9 | Active |
| US6617700B2 | Repairable multi-chip package and high-density memory card having the package | Electricity | 8 | Expired |
| US7307342B2 | Interconnection structure of integrated circuit chip | Electricity | 8 | Expired |
| US5933708A | Lead-on-chip semiconductor package and method for making the same | Electricity | 7 | Expired |
| US6642627B2 | Semiconductor chip having bond pads and multi-chip package | Electricity | 6 | Expired |
| US6825511B2 | Semiconductor device having fuse circuit on cell region and method of fabricating the same | Electricity | 5 | Expired |
| US7576440B2 | Semiconductor chip having bond pads and multi-chip package | Electricity | 5 | Active |
| US7312143B2 | Wafer level chip scale package having a gap and method for manufacturing the same | Electricity | 5 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.