Method to increase removal rate of oxide using fixed-abrasive
US6485355B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2001 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Jun 22, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides fixed-abrasive chemical-mechanical polishing processes which are effective in rapidly reducing thickness of oxide layers, especially siliceous oxides. The processes of the invention are preferably characterized by at least one step involving simultaneous use of a fixed-abrasive polishing element and an aqueous liquid medium containing an abrasive. Where the original oxide layer has topographic variation, the thickness reduction technique of the invention may be preceeded by topography reduction step using a fixed-abrasive and an aqueous medium containing a polyelectrolyte for at least a portion of the polishing process involving reduction in the amount of topographic variation (height differential) across the oxide layer on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.