Alexander William Simpson
26Patents
9h-index
25Co-inventors
71Inventor score
Filing activity: Dec 22, 1999 → Apr 5, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6570256B2 | Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates | Electricity | 48 | Expired |
| US9067297B2 | Polishing pad with foundation layer and polishing surface layer | Performing Operations; Transporting | 29 | Active |
| US6740539B2 | Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates | Electricity | 22 | Expired |
| US9211628B2 | Polishing pad with concentric or approximately concentric polygon groove pattern | Performing Operations; Transporting | 20 | Active |
| US7582127B2 | Polishing composition for a tungsten-containing substrate | Electricity | 18 | Active |
| US6485355B1 | Method to increase removal rate of oxide using fixed-abrasive | Performing Operations; Transporting | 14 | Expired |
| US7247567B2 | Method of polishing a tungsten-containing substrate | Electricity | 13 | Expired |
| US6569769B1 | Slurry-less chemical-mechanical polishing | Electricity | 12 | Expired |
| US6294470A | Slurry-less chemical-mechanical polishing | Electricity | 12 | Expired |
| US9649742B2 | Polishing pad having polishing surface with continuous protrusions | Performing Operations; Transporting | 9 | Active |
| US6841480B2 | Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate | Electricity | 7 | Expired |
| US7011574B2 | Polyelectrolyte dispensing polishing pad | Electricity | 5 | Expired |
| US6350692B1 | Increased polish removal rate of dielectric layers using fixed abrasive pads | Electricity | 3 | Expired |
| US10160092B2 | Polishing pad having polishing surface with continuous protrusions having tapered sidewalls | Performing Operations; Transporting | 3 | Active |
| US8439994B2 | Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection | Performing Operations; Transporting | 3 | Active |
| US9597769B2 | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer | Performing Operations; Transporting | 2 | Active |
| US8628384B2 | Polishing pad for eddy current end-point detection | Performing Operations; Transporting | 2 | Active |
| US6932674B2 | Method of determining the endpoint of a planarization process | Performing Operations; Transporting | 2 | Expired |
| US6899597B2 | Chemical mechanical polishing (CMP) process using fixed abrasive pads | Electricity | 1 | Expired |
| US9597777B2 | Homogeneous polishing pad for eddy current end-point detection | Performing Operations; Transporting | 0 | Active |
| US6893968B2 | Defect-minimizing, topology-independent planarization of process surfaces in semiconductor devices | Electricity | 0 | Expired |
| US9028302B2 | Polishing pad for eddy current end-point detection | Performing Operations; Transporting | 0 | Active |
| US10293459B2 | Polishing pad having polishing surface with continuous protrusions | Performing Operations; Transporting | 0 | Active |
| US6827635B2 | Method of planarizing substrates | Performing Operations; Transporting | 0 | Expired |
| US9931728B2 | Polishing pad with foundation layer and polishing surface layer | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.