Apparatus for coating substrates with materials, particularly for lacquering si-wafers
US6485568B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Apr 18, 2000 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Apr 18, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an apparatus for coating substrates with materials, particularly for lacquering Si-wafers (9) with photosensitive material, comprising a treating chamber (1,16) holding a carrier (10) (chuck) for the substrate to be treated and at least one atomizing nozzle (2) generating a spray jet of the coating material, which may be dosed and which is directed towards the substrate, and a propellant gas, additional guiding and, respectively or, processing devices (6) are arranged between the atomizing nozzle or nozzles (2) and the substrate carrier (10) in the treating chamber (1, 16), which devices comprise nozzles or swirl generators charged with compressed gas or compressed gas and a solvent, and/or centrifugal disks, small turbines, or the like, and produce the spray jet directed towards the substrate from the spray mist generated by the atomizing nozzle or nozzles, for additionally influencing and controlling the spray jet and thereby to improve the quality of the material application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.