Apparatus and method for mounting BGA devices
US6485843B1 · kind B1 · utility
10Cited by
10References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 28, 2001 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Sep 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A surface-mount device attach method for attaching solder ball-grid array or solder column-grid array surface-mount devices to a printed circuit board where the conventional solder mask structure is replaced with a layer of plated nickel to prevent printed circuit board warping caused by the mismatch in the coefficients of thermal expansion between the conventional solder mask and the printed circuit board. A native nickel-oxide layer that forms on the surface of the exposed portions of the plated nickel layer functions as a solder dam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.