Mohammad Eslamy
14Patents
5h-index
9Co-inventors
55Inventor score
Filing activity: Nov 4, 1997 → Oct 13, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6640415B2 | Segmented contactor | Emerging Cross-Sectional Technologies | 121 | Expired |
| US6596618B1 | Increased solder-bump height for improved flip-chip bonding and reliability | Electricity | 14 | Expired |
| US6485843B1 | Apparatus and method for mounting BGA devices | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7838339B2 | Semiconductor device package having features formed by stamping | Emerging Cross-Sectional Technologies | 9 | Active |
| US6784536B1 | Symmetric stack up structure for organic BGA chip carriers | Electricity | 7 | Expired |
| US6130113A | Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process | Electricity | 4 | Expired |
| US7578057B2 | Method of fabricating segmented contactor | Emerging Cross-Sectional Technologies | 3 | Active |
| US7065870B2 | Segmented contactor | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7691670B2 | Interconnection of lead frame to die utilizing flip chip process | Electricity | 2 | Active |
| US8106493B2 | Semiconductor device package having features formed by stamping | Emerging Cross-Sectional Technologies | 2 | Active |
| US7215131B1 | Segmented contactor | Emerging Cross-Sectional Technologies | 2 | Expired |
| US8011089B2 | Method of repairing segmented contactor | Emerging Cross-Sectional Technologies | 1 | Active |
| US8120154B2 | Interconnection of lead frame to die utilizing flip chip process | Electricity | 0 | Active |
| US5973398A | Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.