Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate
US6486411B2 · kind B2 · utility
21Cited by
5References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2001 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Mar 20, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.