Semiconductor module with encapsulant base
US6486549B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 10, 2001 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Nov 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a first semiconductor chip assembly, a second semiconductor chip assembly, an encapsulant base and an electrical interconnect. The first assembly includes a first semiconductor chip, a first conductive trace and a first connection joint, the first chip includes a first conductive pad, the first trace extends within and outside a periphery of the first chip, and the first connection joint contacts and electrically connects the first trace and the first pad. The second assembly includes a second semiconductor chip, a second conductive trace and a second connection joint, the second chip includes a second conductive pad, the second trace extends within and outside a periphery of the second chip, and the second connection joint contacts and electrically connects the second trace and the second pad. The encapsulant base is disposed between and in contact with the first and second chips and the first and second traces. The electrical interconnect contacts the first and second traces in a through-hole that extends through the encapsulant base and is located outside the peripheries of the first and second chips, thereby electrically connecting the first and …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.