Patent assignee · TW · COMPANY

BRIDGE SEMICONDUCTOR CORP.

164Patents
107Active
164Granted
52Portfolio score

Filing activity: Nov 6, 1998 → Aug 22, 2019 · 57 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US7067911B1 Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture Electricity 139 Expired
US7009297B1 Semiconductor chip assembly with embedded metal particle Electricity 131 Expired
US6353324B1 Electronic circuit Physics 113 Expired
US6486549B1 Semiconductor module with encapsulant base Electricity 107 Expired
US7750483B1 Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal Electricity 103 Active
US7262082B1 Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture Electricity 98 Active
US7268421B1 Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond Electricity 82 Active
US6744126B1 Multichip semiconductor package device Emerging Cross-Sectional Technologies 76 Expired
US7071573B1 Semiconductor chip assembly with welded metal pillar Electricity 76 Expired
US6740576B1 Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly Electricity 63 Expired
US7190060B1 Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same Electricity 62 Expired
US6809414B1 Semiconductor chip assembly with bumped conductive trace Electricity 62 Expired
US7417314B1 Semiconductor chip assembly with laterally aligned bumped terminal and filler Electricity 60 Active
US8525214B2 Semiconductor chip assembly with post/base heat spreader with thermal via Electricity 54 Active
US7538415B1 Semiconductor chip assembly with bumped terminal, filler and insulative base Electricity 52 Active
US6794741B1 Three-dimensional stacked semiconductor package with pillars in pillar cavities Electricity 50 Expired
US7190080B1 Semiconductor chip assembly with embedded metal pillar Electricity 47 Expired
US7192803B1 Method of making a semiconductor chip assembly with simultaneously formed interconnect and connection joint Electricity 35 Expired
US6803651B1 Optoelectronic semiconductor package device Emerging Cross-Sectional Technologies 32 Expired
US6414318B1 Electronic circuit Physics 31 Expired
US7993983B1 Method of making a semiconductor chip assembly with chip and encapsulant grinding Electricity 30 Active
US7446419B1 Semiconductor chip assembly with welded metal pillar of stacked metal balls Electricity 29 Active
US6876072B1 Semiconductor chip assembly with chip in substrate cavity Electricity 29 Expired
US7132741B1 Semiconductor chip assembly with carved bumped terminal Electricity 27 Expired
US7245023B1 Semiconductor chip assembly with solder-attached ground plane Electricity 25 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.