Circuit card assembly having controlled vibrational properties
US6486589B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2000 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | May 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2045
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Piezoelectric wafers are affixed to a circuit card to control displacement of the circuit card when vibrated. A trigger wafer located at an anti-node of the dominant mode shape produces a voltage as a function of modal displacement. A control system responsive to the trigger wafer produces voltages that are applied to flex wafers at a different anti-node of the dominant mode shape. The flex wafers expand and contract in a manner that reduces the modal displacement of the circuit card. Multiple flex wafers can exist, affixed to the circuit card substantially opposite each other, or a single flex wafer can exist with a single trigger wafer. The trigger wafer can be located substantially opposite the flex wafer or can be located elsewhere on the circuit card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.