Wire bonding method and apparatus
US6488198B1 · kind B1 · utility
0Cited by
10References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1999 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Jul 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/60
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process and apparatus are described for wire bonding circuit pads of large scale integrated design. The bonding process employs a capillary tool that applies heat and pressure to the wires in order to bond them to the circuit pad. The circuit pad is supported upon a closed woven, fiberglass mesh, which supports the circuit pad during the bonding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.