Conductive paste, its manufacturing method, and printed wiring board using the same
US6488869B2 · kind B2 · utility
4Cited by
6References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1998 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Apr 8, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3192
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive paste has conductive particles having metal particle surface coated with a complex of same metal of less than 10 nm in thickness and not having spontaneous oxide film on said metal particles, and a binder mainly composed of an insulating resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.