Implementing micro BGA™ assembly techniques for small die
US6489557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1999 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Aug 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention introduces a method of implementing micro BGA. More specifically, the present invention discloses a method of packaging an integrated circuit into an integrated circuit assembly. The method of the present invention first mounts polyimide tape to a lead frame. The polyimide tape serves as a substrate for the integrated circuit package. Next, a piece of elastomer is coupled to said polyimide tape. Then an integrated circuit die is attached to said elastomer. Lead beams are then bonded from bond pads on said die to said lead frame. Solder balls are attached to said lead frame. The attached solder balls may be located beyond the area of said die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.