Inventor · Boise, ID, US

Steven Eskildsen

25Patents
7h-index
20Co-inventors
69Inventor score

Filing activity: Dec 15, 1992 → Dec 28, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US6605875B2 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size Electricity 37 Expired
US6489557B2 Implementing micro BGA™ assembly techniques for small die Electricity 24 Expired
US6704204B1 IC package with edge connect contacts Electricity 24 Expired
US5336456A Method of producing a scribelined layout structure for plastic encapsulated circuits Electricity 13 Expired
US8198717B1 Signal shifting to allow independent control of identical stacked memory modules Electricity 12 Active
US6356456B2 Low pin count card retainer Electricity 11 Expired
US6547570B2 IC package with quick connect feature Electricity 9 Expired
US6655022B1 Implementing micro BGA assembly techniques for small die Emerging Cross-Sectional Technologies 6 Expired
US7533457B2 Packaging method for circuit board Emerging Cross-Sectional Technologies 4 Active
US6250934A IC package with quick connect feature Electricity 3 Expired
US8952515B1 Signal shifting to allow independent control of identical stacked memory modules Electricity 2 Active
US10153221B1 Face down dual sided chip scale memory package Electricity 2 Active
US8536716B1 Supply voltage or ground connections for integrated circuit device Electricity 2 Active
US8749074B2 Package including an interposer having at least one topological feature Electricity 2 Active
US11385949B2 Apparatus having a multiplexer for passive input/output expansion Physics 0 Active
US10877678B2 Selection component that is configured based on an architecture associated with memory devices Physics 0 Active
US11347415B2 Selection component that is configured based on an architecture associated with memory devices Physics 0 Active
US10846158B2 Apparatus having multiplexers for passive input/output expansion and methods of their operation Physics 0 Active
US7823279B2 Method for using an in package power supply to supply power to an integrated circuit and to a component Emerging Cross-Sectional Technologies 0 Expired
US10366934B2 Face down dual sided chip scale memory package Electricity 0 Active
US8860496B2 Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices Electricity 0 Active
US8999763B2 Package including an interposer having at least one topological feature Electricity 0 Active
US8531849B1 Supply voltage or ground connections including bond pad interconnects for integrated circuit device Electricity 0 Active
US8829693B2 Supply voltage or ground connections for integrated circuit device Electricity 0 Active
US9269403B2 Independent control of stacked electronic modules Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.