Molded tape ball grid array package
US6489571B1 · kind B1 · utility
1Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2000 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Dec 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A molded tape ball grid array package includes a molding compound and a tape substrate having a top surface for mounting a die thereon, a bottom surface for attaching solder balls, and vias for forming connections between the solder balls and the die wherein the molding compound surrounds the die and the tape substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.