Microelectronic device structure utilizing a diamond inlay in a package flange
US6489634B1 · kind B1 · utility
4Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2001 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Aug 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic device structure includes a package flange with a body having a body upper surface, a substantially circular body interior sidewall defining an opening in the body upper surface, and a substantially circular inlay made of CVD diamond. The inlay is received into the substantially circular opening and has an inlay exterior sidewall which is adjacent to the body interior sidewall and is brazed thereto. The inlay has an inlay upper surface that is substantially coplanar with the body upper surface. A microelectronic device is affixed to the inlay upper surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.