Christopher P. Schaffer
17Patents
8h-index
12Co-inventors
65Inventor score
Filing activity: May 18, 2000 → Jul 29, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7301235B2 | Semiconductor device module with flip chip devices on a common lead frame | Electricity | 34 | Expired |
| US6946740B2 | High power MCM package | Electricity | 33 | Expired |
| US8591262B2 | Substrate inductive devices and methods | Emerging Cross-Sectional Technologies | 22 | Active |
| US7845984B2 | Power-enabled connector assembly and method of manufacturing | Emerging Cross-Sectional Technologies | 14 | Active |
| US8860543B2 | Wire-less inductive devices and methods | Emerging Cross-Sectional Technologies | 13 | Active |
| US7708602B2 | Connector keep-out apparatus and methods | Emerging Cross-Sectional Technologies | 12 | Active |
| US6534792B1 | Microelectronic device structure with metallic interlayer between substrate and die | Electricity | 10 | Expired |
| US7982572B2 | Substrate inductive devices and methods | Emerging Cross-Sectional Technologies | 9 | Active |
| US8234778B2 | Substrate inductive devices and methods | Emerging Cross-Sectional Technologies | 6 | Active |
| US7942700B2 | Modular electronic header assembly and methods of manufacture | Emerging Cross-Sectional Technologies | 5 | Active |
| US6489634B1 | Microelectronic device structure utilizing a diamond inlay in a package flange | Electricity | 4 | Expired |
| US8845367B2 | Modular electronic header assembly and methods of manufacture | Emerging Cross-Sectional Technologies | 3 | Active |
| US8118619B2 | Power-enabled connector assembly and method of manufacturing | Emerging Cross-Sectional Technologies | 3 | Active |
| US8754734B2 | Simplified inductive devices and methods | Electricity | 1 | Active |
| US7453146B2 | High power MCM package with improved planarity and heat dissipation | Electricity | 0 | Active |
| US7745257B2 | High power MCM package with improved planarity and heat dissipation | Electricity | 0 | Active |
| US7355431B2 | Test arrangement including anisotropic conductive film for testing power module | Physics | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.