Multi-cavity substrate structure for discrete devices
US6489686B2 · kind B2 · utility
31Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2001 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Mar 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The distance between a discrete or passive electrical component and an electrical semiconductor device and substrate or carrier is minimized by shortening the lead length connections of the passive component. One or more passive electronic components are mounted within the body of a carrier or board by creating a cavity in the substrate or carrier that is directly below a semiconductor device. The passive component is electrically connected to the substrate and device using solder bump technology resulting in much shorter lead length connections to and from the passive component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.