Integrated circuit package having a substrate vent hole
US6490166B1 · kind B1 · utility
19Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1999 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Jun 11, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and an integrated circuit mounted to the substrate. An underfill material is dispensed between the substrate and the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.