Semiconductor package ejector
US6490167B1 · kind B1 · utility
1Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1999 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Nov 10, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6335
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In an embodiment of the present invention, an apparatus to eject a semiconductor package from a semiconductor package socket includes a package ejector coupled to a semiconductor package socket. The package ejector can include an ejector cam and be coupled to an upper surface of the semiconductor package socket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.