Wafer processing equipment and method for processing wafers
US6491451B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2000 |
| Grant date | Dec 10, 2002 |
| Priority date | — |
| Expiry date | Feb 15, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/135
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing equipment comprises a track (10) for transporting wafers, a wafer launch station (20) for launching wafers into a section of said track (10), a first wafer processing tool (30) for performing a first process to wafers in said section of said track (10), a buffer (40) for storing wafers processed by said first wafer processing tool (30), a second wafer processing tool (50) for performing a second process to wafers processed by said first wafer processing tool (30), and control means (70) for controlling said wafer launch station (20) such that every wafer launched by said launch station (20) is processed by said second processing tool (50) within a predetermined time window.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.