Cutting instrument having integrated sensors
US6494882B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2000 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Jul 25, 2020 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2090/0814
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A cutting instrument including a metal blade has a recess formed therein and a semiconductor substrate affixed to the blade in the recess. The semiconductor substrate includes at least one sensor formed thereon. The sensor formed on the semiconductor substrate may comprise at least one or an array of a strain sensors, pressure sensors, nerve sensors, temperature sensors, density sensors, accelerometers, and gyroscopes. The cutting instrument may also further include a handle wherein the blade is affixed to the handle and the semiconductor substrate is electrically coupled to the handle. The handle may then be coupled, either physically or by wireless transmission, to a computer that is adapted to display information to a person using the cutting instrument based on signals generated by one or more of the sensors formed on the semiconductor substrate. The computer or handle may also be adapted to store data based on the signals generated by one or more of the sensors. A method of making said cutting instrument includes the steps of at least one sensor being formed on a semiconductor wafer and a layer of photoresist being applied on a top side of the semiconductor wafer according to …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.