Manufacturing fire retardant circuit boards without the use of fire retardant resin additives
US6495244B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2000 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Feb 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/252
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to printed circuit boards having improved fire resistance and improved environmental stability. The invention provides halogen-free fire retardant printed circuit boards incorporating potentially flammable polymers. Flame resistant thermoplastic layers prevent combustion of thermosetting polymers, as well as adding strength to the laminate, resulting in a less brittle thin core than the prior art. The flame resistant circuit board is cost efficient, environmentally safe and has excellent properties, including a decreased probability of shorting, good dielectric breakdown voltage, a smooth surface and good electrical/thermal performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.