Method for improving the quality of a metal layer deposited from a plating bath
US6495453B1 · kind B1 · utility
16Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2000 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Jun 22, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is related to a method for depositing a metal-containing film from a metal plating bath, comprising the steps of subsequently depositing a metal-containing layer from a metal plating bath followed by a heating step and/or a vacuum step, said subsequent steps being repeated for a number of times in different sequences.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.