Transmission equalization system and an integrated circuit package employing the same
US6496081B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2001 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Sep 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B3/14
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention provides a transmission equalization system for use with an integrated circuit package employing a substrate. In one embodiment, the transmission equalization system includes a signal transmission subsystem having a pair of transmission line conductors located in the substrate and employing a differential electrical signal. The transmission equalization system also includes an equalization subsystem located proximate the pair of transmission line conductors that employs at least one aperture positioned and oriented to provide a substantially equivalent transmission environment for each of the pair of transmission line conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.