Anand Govind
12Patents
6h-index
11Co-inventors
52Inventor score
Filing activity: Jun 27, 2001 → Mar 7, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6701270B1 | Method for reliability testing leakage characteristics in an electronic circuit and a testing device for accomplishing the source | Physics | 61 | Expired |
| US7095107B2 | Ball assignment schemes for integrated circuit packages | Electricity | 17 | Expired |
| US6531932B1 | Microstrip package having optimized signal line impedance control | Electricity | 11 | Expired |
| US6496081B1 | Transmission equalization system and an integrated circuit package employing the same | Electricity | 10 | Expired |
| US6700207B2 | Flip-chip ball grid array package for electromigration testing | Electricity | 10 | Expired |
| US6759921B1 | Characteristic impedance equalizer and an integrated circuit package employing the same | Electricity | 7 | Expired |
| US7081672B1 | Substrate via layout to improve bias humidity testing reliability | Electricity | 6 | Expired |
| US7345245B2 | Robust high density substrate design for thermal cycling reliability | Electricity | 3 | Expired |
| US6946866B2 | Measurement of package interconnect impedance using tester and supporting tester | Physics | 2 | Expired |
| US7105926B2 | Routing scheme for differential pairs in flip chip substrates | Electricity | 2 | Expired |
| US6534968B1 | Integrated circuit test vehicle | Electricity | 1 | Expired |
| US6825066B2 | Stiffener design | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.