High capacity memory module with high electrical design margins
US6496380B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2000 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Aug 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10022
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention features a memory module for use in conjunction with high speed, impedance-controlled buses. Each memory card may be a conventional printed circuit card with memory chips attached directly thereto. Alternately, high density memory modules assembled from pluggable sub-modules may be used. These sub-modules may be temporarily assembled for testing and/or burn-in. Bus terminations mounted directly on the memory card or the memory module eliminate the need for bus exit connections, allowing the freed-up connection capacity to be used to address additional memory capacity on the module. An innovative pin-in-hole contact system is used both to connect sub-modules to the memory module and, optionally, to connect the memory module to a motherboard or similar structure. A thermal control structure may be placed in the memory module, cooling the increased number of memory chips to prevent excess heat build-up and ensure reliable memory operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.