Headset with overmold
US6496589B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2001 |
| Grant date | Dec 17, 2002 |
| Priority date | — |
| Expiry date | Jun 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R5/0335
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A headset is disclosed having a headband configuration that distributes the compression forces on the user's head to provide firm placement without causing discomfort to the user. The headband is preferably integrally formed with a soft overmold molded along a portion of its interface with the user's head. The headband terminates in first and second ends. Either or both ends may terminate in a flared temple pad for further distribution of compression forces or may terminate in an earphone. A boom is pivotally connected to either a temple pad or an earphone and is optionally conformable for positioning towards the wearer's mouth. The boom terminates in a microphone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.