LGA connector with integrated gasket
US6497582B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 22, 2001 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Aug 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/7076
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Land grid array (LGA) connectors are used to attach circuit modules to printed circuit boards that present an array of noble metal or semi-noble metal plated contacts to not only effect a reliable connection, but also enable circuit module release and replacement. During replacement, the connector is discarded and a replacement circuit module is used. Only the contact array on the printed circuit board is reused. An in situ gasket carried by the connector is compressed against the circuit board in the assembled condition to form a sealed enclosure about the contact array at the printed circuit board surface which excludes particulate and gaseous contaminants. Thus when the module is replaced, the contact array site on the printed circuit board does not require cleaning or processing to overcome degradation of the contact materials or surfaces. Beyond providing a sealed enclosure, the gasket material should be selected for sealing, but inelastic qualities so that the uniform pressure applied to the contacts of the array is not impaired nor the total required contact force increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.